Background and Challenges
Cear’s compact speaker, “Cear pavé,” has seen increasing adoption in various venues, including live performance spaces, art exhibitions, and sports facilities. Users have expressed a desire for features such as EQ settings, batch control of multiple pavé units, and simpler setup. Simultaneously, as applications utilizing numerous pavé units for wave field synthesis advanced, a robust control mechanism became essential for developers. “Cear Connect” emerged as the solution to these user requests and development necessities.
About Cear Connect
Cear Connect is defined as a “transport-independent common protocol layer for acoustic device control and parameter transfer.” It unifies four standards—USB HID, Bluetooth® LE (GATT), Bluetooth® LE Audio Periodic Advertisement, and Auracast™—under a single API, allowing a single smartphone to operate numerous acoustic devices in real time.
Examples of Functions Achieved with Cear Connect:
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Rewriting internal device parameters (e.g., bit rate, delay, sound field settings)
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Batch control of multiple devices, reproduction and distribution of settings
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Auracast™-based spatial audio control (Cear Field)
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Transport-independent access to existing wired and wireless devices
Cear Connect Compatible OEM Modules
The Cear pavé board, equipped with the Cear Connect compatible software stack, has been modularized. This module supports Auracast™ reception and playback, parameter reception via LE Audio PA, and settings changes via Bluetooth LE (GATT). Integrating this module into proprietary products enables immediate participation in the ecosystem. Mass production is scheduled for April 2026.
Spatial Audio Implementation Achievements
Cear’s acoustic technology has already been adopted in notable locations and events both domestically and internationally, including:
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EXPO 2025 Osaka, Kansai Pavilion of the United Kingdom — Spatial audio production
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Sapporo Snow Festival 2026 “The Snow Lounge” — Spatial audio installation
Recruitment of Early Partners
Cear Inc. is currently seeking early partner companies to join the Cear Connect ecosystem. After the mass production shipment in April 2026, Cear Connect modules will be provided to support joint development and product commercialization.
Contact Information:
Cear Inc.
Contact: Sen Takaoka
Email: takaoka@cear.co.jp
For general inquiries regarding this release, please visit: https://www.cear.co.jp
- The Bluetooth® and Auracast™ word marks and logos are owned by Bluetooth SIG, Inc. Qualcomm®, Snapdragon Sound™, and Dragonwing™ are trademarks or registered trademarks of Qualcomm Incorporated. Awesound® is a registered trademark of Rion Co., Ltd., and Cear Inc. uses it under a sublicense agreement.
